JPH0231788Y2 - - Google Patents
Info
- Publication number
- JPH0231788Y2 JPH0231788Y2 JP1057486U JP1057486U JPH0231788Y2 JP H0231788 Y2 JPH0231788 Y2 JP H0231788Y2 JP 1057486 U JP1057486 U JP 1057486U JP 1057486 U JP1057486 U JP 1057486U JP H0231788 Y2 JPH0231788 Y2 JP H0231788Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- frame
- semiconductor wafer
- mounting
- mounting surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 229920003002 synthetic resin Polymers 0.000 claims description 5
- 239000000057 synthetic resin Substances 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 45
- 238000005520 cutting process Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000008188 pellet Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1057486U JPH0231788Y2 (en]) | 1986-01-28 | 1986-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1057486U JPH0231788Y2 (en]) | 1986-01-28 | 1986-01-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62124852U JPS62124852U (en]) | 1987-08-08 |
| JPH0231788Y2 true JPH0231788Y2 (en]) | 1990-08-28 |
Family
ID=30796993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1057486U Expired JPH0231788Y2 (en]) | 1986-01-28 | 1986-01-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231788Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010205817A (ja) * | 2009-03-02 | 2010-09-16 | Shin Etsu Polymer Co Ltd | 電子部品保持具 |
-
1986
- 1986-01-28 JP JP1057486U patent/JPH0231788Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010205817A (ja) * | 2009-03-02 | 2010-09-16 | Shin Etsu Polymer Co Ltd | 電子部品保持具 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62124852U (en]) | 1987-08-08 |
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